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Welcome to Tianjin Guoce Aerospace Technology Co., Ltd!

Tianjin GuoCe Aerospace Technology Co., Ltd.

Inspection Industry Solution Provider

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Communication detection

  • Hot Line：18322499311

   Communication detection capability
Electromagnetic Radiation Detection

Product rangeDetection standard
Communication base stations, substations, etc" Environmental Electrical Wave Health Standards"  GB 9175-1998
" Regulations on Electromagnetic Radiation Protection"  GB8702-1988
" Guidelines for Radiation Environmental Protection Management - Electromagnetic Radiation Monitoring and Methods"  HJ/T10.2-1996
" Guidelines for Radiation Environmental Protection Management - Methods and Standards for Electromagnetic Radiation Environmental Impact Assessment"  HJ/T10.3-1996
" Methods for Electromagnetic Radiation Environmental Monitoring of Mobile Communication Base Stations"< br/>

 Wireless monitoring equipment monitoring

TypeDetection itemsDetection standard
Electrical performancedemodulation sensitivity, monitoring sensitivity, frequency tuning resolution, frequency accuracy, intermediate frequency selectivity, third-order cutoff point, etcGB/T 32401-2015
Technical requirements and testing methods for VHFUHF frequency band radio monitoring receivers
Electromagnetic compatibilityPower terminal disturbance voltage, radiation disturbance emissionGB/T 34089-2017
VHFUHF Radio Monitoring and Direction Finding System
Electrical safety
Opening test parameters and testing methods
Environmental adaptabilitylow temperature, High temperature, temperature change, impact, vibration, damp heat, dripping waterGB 4824, GB 4793.1, GB/T 2423

 Quality and reliability of electronic products

TypeDetection items
Communication chip reliability verificationNew product NPI import reliability verification (PC/HAST/THB/HTSL)
Chip level ESD (HBM/CDM/LU) testing
IP ESD capability design verification
Aging life verification
Process risk assessment verification
Electrical performance and functional testingChip level testing and three temperature verification (room temperature/low temperature/high temperature)
Process quality evaluationCompetitive analysis
PCB/PCBA metallographic section testing
X-ray perspective testing
Product batch failure analysis
Non destructive testing analysis
SOC chip failure analysisElectrical performance analysis
Sample failure analysis
Precision microscope analysis

 Communication Equipment Test
1，  Environmental and reliability testing

Test itemTemperature test, high temperature, humid heat, low temperature, temperature cycle, rapid temperature change, temperature shock, high acceleration screening test, moisture resistance, salt spray, rain, sand and dust test, high-altitude low-pressure test, vibration, drop, immersion, mechanical shock, high acceleration shock, xenon lamp test, ultraviolet irradiation, sunlight test, fiber optic pressure test, fiber optic torsion test, collision test, gas corrosion test

  2，  Electromagnetic compatibility test

Test itemTest standard
Conducted Disturbances (CE)
Radiated Disturbances (RE)
Electrostatic Discharge Immunity (ESD)
Radio Frequency Radiation Immunity (RS)
Electrical Fast Transient (EFT)
Surge
Conducted Disturbances Induced by Radio Frequency Fields (CS)
Power Frequency Magnetic Field Immunity (PFMF)
Pulse Magnetic Field Immunity (PMF)
Voltage Transient, Short Interruption, and Voltage
Variation Immunity DIP
CISPR 32/35 (EN 55032/35)
ETSI 301 489 series
EN 300 386
IEC 61000-4-2/-3/-4/-5/-6/-8/-11
IEC 61000-3-2/-3
ITU-T K.20/21 (K.44/45)
GB 9254
GB 19286
YD/T 993
GB/T 17626.2/.3/.4/.5/.6/.8/11
GB 17625.1/2

 



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